by Nishimura Advanced Ceramics.
- Product
- Technology
- Case Study
- News
- Company
- JP / EN
This is an example of actual use of the ANYCHUCK Partial adsorbing vacuum chuck table. We customise our products in various ways according to the actual workpieces envisaged. We are happy to consult with customers from the stage when the solution to their problems is not yet clear.
| Work piece | Industry | Process/Operation Details | Challenge | Result | Detail |
|---|---|---|---|---|---|
| Metallic Foil | Thin Film Printing | Adsorbs and fixes metal foil during printing on metal foil | Difficult to adsorb metal foil evenly and without damage. | Metal foil could be adsorbed evenly and without damage | |
| Film | Film Industry | Pulls film from roller, cuts, reverses chuck and passes to another chuck | There was no Anti-static type chuck table. / Enough adsorbing power was needed to transport the film stably. | Developed anti-static grades for film | |
| Ceramics | Electronic Components | Multiple small workpieces can be conveyed together and passed on to the next process. | The structure becomes more complex if partial adsorption is not possible. | The use of partial adsorption grade products enables multiple pieces to be conveyed simultaneously. | |
| Film | Thin Film Printing | Fix the film and peel off the resin part printed on the film surface. | Partial adsorption required due to sparse film size. Strong adsorption required to prevent the film from peeling off. | Strong partial adsorption of film. | |
| Glass substrates | Electronic components | Simultaneous suction and image inspection of a large number of glass substrates of 0.1 mm dia. | Conventional vacuum chucks are not able to partially grip workpieces with a diameter of 0.1 mm. | Partial adsorption at the level required for the inspection is possible. | |
| Wafer | Inspection System | Wafers of different diameters and shapes are suction-fixed and inspected for their flatness value. | With conventional vacuum chucks, it is necessary to manufacture a vacuum chuck for each workpiece shape, or to use a multi-chuck type, which increases costs. | A single chuck can be used to hold wafers of different shapes. |