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SiC(Silicon Carbide) Size □15×2t(mm) φ0.35 hole
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ALN-170(Aluminum Nitride) Size □25×2t
Our semiconductor flip chip bonding tool attachment supports precise heating processes in bonding equipment and flip chip bonders.
If you need further refinement or industry-specific phrasing, let me know!
Applications
- Bonding Equipment: Heat tools, attachments
- Flip Chip Bonders: Tool heads, attachments
Flip chip bonders utilizing TSV (Through-Silicon Via) technology support HBM (High Bandwidth Memory) and FO-WLP (Fan-Out Wafer Level Packaging), positioning them as cutting-edge solutions in semiconductor packaging.
Features
- Custom Made
Materials
We use high thermal conductivity ceramics, which offer excellent electrical insulation and stability at high temperatures.
- Aluminum Nitride (ALN): 170W/mK, 200W/mK, 250W/mK
- Silicon Carbide (SiC): 170W/mK