Nishimura Advanced Ceramics specializes in high-performance Aluminum Nitride (ALN) ceramics, offering multiple grades tailored for advanced thermal management applications.
- ALN-170 – Standard grade Aluminum Nitride (thermal conductivity: 170W/mK)
- ALN-200 – High thermal conductivity Aluminum Nitride (thermal conductivity: 200W/mK)
- ALN-250 – Ultra-high thermal conductivity Aluminum Nitride (thermal conductivity: 250W/mK)
- ALN-HY0 – High-purity grade with no auxiliaries (thermal conductivity: 90W/mK)
↑Picture of AlN-200 substrate
Advantages of Aluminum Nitride (ALN) Ceramics
✅ Superior Thermal Conductivity – Efficient heat dissipation for high-power applications
✅ High Electrical Insulation – Ideal for semiconductor components
✅ Exceptional Thermal Shock Resistance – Reliable in extreme conditions
✅ Compatible Thermal Expansion – Matches well with Silicon wafers
✅ Corrosion Resistance to Fluorine-Based Gasses – Ideal for harsh environments
✅ Outstanding Plasma Resistance – Suitable for semiconductor and aerospace applications
Available Shapes & Sizes
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Nishimura Advanced Ceramics offers ALN products in various customizable shapes and dimensions, including:
🔸 Plates, Bars, Pipes, Crucibles, Complex Designs – Fully adaptable for specific needs
🔹 Large formats available – Up to ∮600mm for demanding applications
🏭 Manufacturing Process
We employ cutting-edge ceramic engineering techniques:
- Machine Pressing – High-precision shaping
- Cold Isostatic Pressing (CIP) – Uniform density control
- Green Processing (Raw Material Machining) – Optimized for complex geometries
🔬 Applications & Industries
Our ALN ceramics are trusted in high-performance electronic and industrial sectors, including:
✔ Heat Sinks & Baseboards – Efficient heat management in electronic circuits. heat dissipation substrate for LD(Laser Diode), power semiconductors and optical communication lasers in the 5G era.
✔ Semiconductor Device Parts – Integrated into advanced fabrication processes
✔ Soaking Plates for Heaters – Enhancing thermal stability
✔ Crucibles for OLED Manufacturing – Essential for high-purity production
✔ Aerospace Industry Components – High-reliability thermal protection
✔ Semiconductor Device Parts – Integrated into advanced fabrication processes
🔹 Want to optimize your thermal management with ALN ceramics? Contact us today!
| AlN material | Nishimura No. | |||
| Properties | AlN-170 | AlN-250 | AlN-HYO | |
| Thermal conductivity | W/mk(R・T) | 170 | 250 | 90 |
| Thermal emissivity | (100℃) | 0.93 | 0.93 | 0.93 |
| Thermal expansion coefficient | 10⁻⁶/℃(RT～400℃) | 4.5 | 4.5 | 4.5 |
| insulation resistane | Ω・cm(RT) | >10¹³ | >10¹³ | >10¹³ |
| Dielectric strength | kV/mm(RT) | 15 | 15 | 15 |
| Dielectric constant | (1MHz) | 8.8 | 8.8 | 8.8 |
| Dielectric loss | 10⁻⁴(1MHZ) | 5 | 5 | 5 |
| Fracture toughness | kgf/mm² | 35 | 40 | 40 |
| Bulk density | g/cm³ | 3.32 | 3.32 | 3.23 |
| Y | % | 3.5 | 3.3 | 0 |
| O | % | 1.5 | 1.2 | 0.58 |
| Metal inpurity | ppm | <500 | <500 | <500 |
| Feature | Standard use |
High thermal conductivity | High purity | |