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Size: □118mm x 0.5t
Since electric vehicles and clean energy are becoming popular, Silicon nitride substrates are drawing attention as power semiconductors with excellent characteristics such as smaller size, lighter weight, and higher output power, compared to Alumina substrate and Aluminum substrate.
Feature
Highly insulating
High heat dissipation due to thin plate processing
Properties
| Items | Unit | Value | ||
| Main material〔Silicon Nitride〕 | ％ | 90 | ||
| secondary material〔sintering additive〕 | ％ | 10 | ||
| density | g/㎤ | 3.2 | ||
| Mechanical Characteristics | Vickers hardness(1kgf) | GPa | 15 | |
| Three-point bending strength | MPa | 850 | ||
| Compression strength | MPa | 3,800 | ||
| Young’s modulus | GPa | 302 | ||
| Poisson’s ratio | － | 0.28 | ||
| Fracture toughness (IF) | MPa･ | 6 | ||
| Thermal Characteristics | Average linear expansion rate | 40-400℃ | 2.7 | |
| Thermal conductivity(20℃) | W/(m･K) | 26.1 | ||
| Specific thermal capacity | J/(g･K) | 0.646 | ||
| Electrical Characteristics | Dielectric breakdown strength | kV/mm | 15 | |
| Volume resistivity ratio | 20℃ | Ω･cm | 5.8×10¹⁶ | |
*The measured values in the table are not guaranteed values but reference values.