 Surface Roughness Ra 0.2 |
 Double-Sided Mirror-Polished: Ra 0.05 |
This AlN (aluminum nitride) dummy wafer combines high thermal conductivity with excellent electrical insulation.
It is ideal for evaluation and handling in semiconductor manufacturing and heat-treatment processes. With stable dimensional accuracy and high heat resistance, it contributes to improved equipment reliability.
Specifications
- Size: OD φ200±0.5mm
- Thickness: 0.65±0.05mm
- TTV: 0.01mm
- Feature: With notch
Features
- High thermal conductivity: Approximately 170W/m・K
- Excellent electrical insulation
- High heat resistance and low thermal expansion
- Supports precision machining
Available sizes: Up to 8 inches (200mm)
Typical applications: Semiconductor manufacturing lines, heat-treatment processes, equipment evaluation
Custom options: Thickness, surface finish, and dimensional accuracy can be specified
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