 Surface Roughness Ra 0.2 |
 Double-Sided Mirror-Polished: Ra 0.05 |
This is a Si3N4 (silicon nitride) dummy wafer featuring exceptional high strength and impact resistance.
It is ideal for semiconductor manufacturing processes that demand mechanical robustness and thermal shock resistance, delivering long service life and high reliability.
Specifications
- Size: OD φ200±0.5mm
- Thickness: 0.65±0.05mm
- TTV: 0.01mm
- Feature: With notch
Features
- High strength and exceellent impact resistance
- Outstanding thermal shock resistance
- Superior chemical stability
- Compatible with precision machining
Available sizes: Up to 8 inches (200mm)
Typical applications: Semiconductor manufacturing lines, heat-treatment processes, equipment evaluation
Custom options: Thickness, surface finish, and dimensional accuracy can be specified